• Read and interpret blueprints and customer specifications • Test substrates to meet specifications • Prepare substrates for dicing function by mounting onto small glass plates • Perform calculations to instruct cutting machines to dice 4” squares into circuits • Use tweezers, chemicals and/or distilled water to remove post-dicing residue • Heat/treat/and/or 100% probe • Read work orders and study assembly drawings to determine heat treat operation to be performed • Adjust heat treat machine/hot plate controls according to work specifications • Examine and test substrate at various stages of production • Maintain records of probe results per resistor • Enter production information into computer via Vantage system • Placing of wax-mounted substrates on glass into vacuum chucks in work area of dicing saws • Manual cleaning of circuits • Prepare circuits for packaging • Utilize tweezers to move circuits from 6” petri dish to waffle packs • Works is often performed under microscope • Perform data entry into manufacturing software • Comply with safety regulations • Participate in team problem-solving.