Senior Packaging Technical Engineer – Hardware

EngineerEngineerFull TimeRemoteSeniorTeam 10,001+Since 1993H1B SponsorCompany SiteLinkedIn

Location

California

Posted

4 days ago

Salary

$168K - $258.8K / year

Seniority

Senior

Bachelor Degree8 yrs expEnglishPerlPython

Job Description

• Crafting and implementing silicon pad rings • Working with a variety of package technology types • Defining and implementing the chip pad ring and substrate interconnect scheme • Leading the package layout design process • Collaborating with Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers • Defining chip floor plan, pad ring, substrate, and ball out implementing a robust electrical package • Communicating effectively with various teams throughout the company

Job Requirements

  • BSEE or equivalent experience
  • Minimum of 8+ years in board/system design
  • Experience with package design is preferred
  • Good understanding of transmission line theory, power delivery and signal integrity is desired
  • Preferred programming and scripting skills in Perl, Python, Tcl
  • Cadence Skill and EXCEL familiarity are useful and a plus
  • Hardworking and able to work with a minimum of supervision
  • Ability to solve complex technical problems

Benefits

  • Equity
  • Comprehensive benefits package

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