Sr ASIC Packaging Engineer

ProcurementProcurementFull TimeRemote

Location

United States

Posted

9 days ago

Salary

Not specified

No structured requirement data.

Job Description

This description is a summary of our understanding of the job description. Click on 'Apply' button to find out more.

Role Description

We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing.

  • EM & Signal Integrity: Lead full-wave 3D electromagnetic simulations using ANSYS HFSS for ASIC package extractions. Optimize bump-to-ball transitions and high-speed SerDes paths using Agilent ADS.
  • Package Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out Wafer-Level Packaging (FOWLP).
  • Integration & Test (I&T): Drive the Integration and Test phase by correlating simulation models with physical hardware measurements (VNA/TDR). Validate package-level power delivery networks (PDN).
  • Prototyping & Additive: Utilize Additive Manufacturing to develop custom heat sinks, interposers, or rapid-prototype substrates, reducing the R&D cycle for complex ASIC form factors.

Qualifications

  • 10+ years in Electronics Packaging, specifically focused on high-bump-count ASICs and high-speed interfaces.
  • Expert proficiency in ANSYS HFSS and Agilent ADS for package-level SI/PI analysis.
  • Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.
  • B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.

Requirements

The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package.

Benefits

  • 15 days of PTO per calendar year
  • 10 paid Holidays per calendar year
  • Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
  • Dental & Vision: Company covers 50% of premiums for Employee and Dependents
  • Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
  • Employee Assistant Program (EAP)
  • 401k - Traditional & Roth
  • Life/AD&D and Long-Term Disability
  • Tuition reimbursement

Job Requirements

  • 10+ years in Electronics Packaging, specifically focused on high-bump-count ASICs and high-speed interfaces.
  • Expert proficiency in ANSYS HFSS and Agilent ADS for package-level SI/PI analysis.
  • Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.
  • B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.
  • The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package.

Benefits

  • 15 days of PTO per calendar year
  • 10 paid Holidays per calendar year
  • Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
  • Dental & Vision: Company covers 50% of premiums for Employee and Dependents
  • Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
  • Employee Assistant Program (EAP)
  • 401k - Traditional & Roth
  • Life/AD&D and Long-Term Disability
  • Tuition reimbursement

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